Post Fab Module / Diffusion / Integration / Device Characterization / Thin Films Engineer

Job Description
Join onsemi's state-of-the-art 300mm wafer fabrication team in Hopewell Junction, NY, developing advanced power semiconductor technologies that enable automotive, industrial, and consumer applications worldwide.

onsemi is hosting an upcoming Engineering Hiring Event in Albany, NY and we have multiple engineering openings across different experience levels and are looking for talented professionals to join our growing semiconductor manufacturing team in Hopewell Junction, NY.

Hiring Event Details
Date: October 7, 2026
Time: 4:00 PM - 7:00 PM EST
Location: Crowne Plaza Albany – The Desmond Hotel, 660 Albany Shaker Rd, Albany, NY 12211

Hiring For 

• Diffusion Module Engineer
• Integration Engineer
• Manufacturing Integration Engineer
• Senior Thin Films Module Engineer
• Device Characterization Engineer
• Senior Post Fab Module Engineer, MOSFET
   

In this role, you will drive process development, manufacturing integration, yield improvement, and continuous process optimization within a high-volume semiconductor manufacturing environment. You will collaborate with cross-functional engineering, operations, equipment, and quality teams to identify opportunities for process improvement, troubleshoot manufacturing challenges, and support the successful development and ramp-up of advanced semiconductor technologies.

 

Key Responsibilities

• Develop and optimize semiconductor manufacturing processes.
• Drive yield improvement and defect reduction initiatives.
• Perform data analysis using SPC, DOE, and statistical methodologies.
• Investigate and resolve process-related manufacturing issues.
• Support new technology development, qualification, and production ramp activities.
• Collaborate with cross-functional teams to improve product performance, quality, and manufacturing efficiency.

Preferred Qualifications

• Bachelor's, Master's, or PhD in Engineering, Physics, Materials Science, or a related field.
• Semiconductor manufacturing, wafer fabrication, or process engineering experience required.
• Experience in high-volume manufacturing environments.
• Knowledge of DOE, SPC, Six Sigma, FMEA, and statistical analysis tools.
• Experience with semiconductor process technologies such as Diffusion, Thin Films, Manufacturing Integration, Device Engineering, Photolithography, or Post Fab Operations.

Why Join onsemi?

• Work on cutting-edge power semiconductor technologies.
• Join a world-class 300mm wafer fabrication facility.
• Competitive salary and benefits package.
• Relocation assistance available for qualifying candidates.
• Opportunities for technical growth and career advancement.

onsemi is excited to share that the base salary range for these positions is $101,700 to $172,700, exclusive of fringe benefits or potential bonuses. The final pay rate for the successful candidate will depend on geographic location, skills, education, experience, and/or consideration of the internal equity of our current team members. We also offer a competitive benefits package. Benefits Summary. Relocation assistance is available for qualifying candidates.