System Engineer - HVDC

Change the world. Love your job. 
Do you want to work for an organization that values your opinion? Do you want to work for an organization where you can play a pivotal role in several different areas? Look no further. As a Texas Instruments (TI) Systems Engineer, you will have the opportunity to work in a vibrant and dynamic team oriented environment with exposure to a variety of state-of-the art applications each day.

Responsibilities may include:

• Define system architectures for high-power-density DC-DC converters, intermediate bus converters (IBCs), and HVDC power delivery solutions.
• Develop power system specifications, requirements, and validation plans.
• Lead topology evaluation, tradeoff analysis, and system optimization for efficiency, power density, cost, and reliability.
• Collaborate with IC design, magnetics, packaging, thermal, firmware, and applications teams.
• Perform modeling and simulation using tools such as SIMPLIS, SPICE, MATLAB, or equivalent.
• Analyze system performance including efficiency, transient response, EMI, thermal behavior, and fault protection.
• Engage directly with hyperscale and enterprise customers to understand future power requirements and translate them into product roadmaps.
• Support product bring-up, debugging, characterization, and customer deployments.

Minimum requirements:

• M.S. or Ph.D. in Electrical Engineering.
• Strong background in power electronics and power conversion architectures.
• Deep understanding of magnetics, resonant converters, switching converters, and power semiconductor devices.
• Experience with system modeling, simulation, and hardware validation.
• Strong analytical and problem-solving skills.
• Excellent communication and cross-functional collaboration abilities.

Preferred qualifications:

• Experience with LLC, DAB, CLLC, multiphase buck, or switched-capacitor converters.
• Knowledge of high-voltage power distribution (48V, 400V, 800V HVDC).
• Familiarity with AI server, GPU, telecom, or data center power architectures.
• Experience with planar magnetics, GaN devices, and advanced packaging technologies.
• Experience working directly with hyperscale customers.